江苏博敏于2011年设立、2014年投产，位于江苏美丽的海港城市大丰，占地面积15万平方米，注册资本1亿元人民币，计划总投资6.2亿元人民币。主要生产高端印制电路板，涵盖高端多层板、高阶HDI板、刚挠结合板等，产品应于通讯设备、智慧城市、医疗器械、网络模块等轻、小、薄、高精密高可靠性产品，规划未来五年工厂产能可达10万平米/月。
硬板制程技术 Rigid PCB Manufacturing Capability
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项 目
Item
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深圳博敏
Shenzhen Bomin
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博敏股份
Bomin Electronic
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江苏博敏
Jiangsu Bomin
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最高生产层数
Max.Layer count
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30L
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2~32L
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2~12L
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最大排版尺寸
Max.Panel Size
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2L: 2000mm*450mm
(78.740″*17.7165″)
≥4L: 1350mm*530mm
(53.1496″*20.8661″)
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546*622mm
(21.4″*24.4″)
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610*762mm
(24″*30″)
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最小完成板厚
Min.Finished Board Thickness
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2L: 0.15mm
(0.0059″)
4L:0.30 mm
(0.0118″)
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0.30mm
(0.0118″)
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0.2mm
(0.0079″)
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最大完成板厚
Max.Finished Board Thickness
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6.50mm
(0.2559″)
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4.00mm
(0.1575″)
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1.60mm
(0.0630″)
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内层最小芯板厚度
Min.Core Thickness
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0.05mm
(0.0020″)
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0.05mm
(0.0020″)
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0.075mm
(0.0030″)
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最小基铜厚度
Min.Cu Thickness(Base)
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8um
(1/4 OZ)
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9um
(1/40Z)
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12um
(1/3 OZ)
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最大基铜厚度
Max.Cu Thickness(Base)
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420um
(12 OZ)
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420um
(12 OZ)
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70um
(2 OZ)
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孔位公差
Drilling Hole to Hole Accuracy
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± 0.05mm
(± 0.0020″)
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± 0.05mm
(± 0.0020″)
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± 0.05mm
(± 0.0020″)
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电铣成型公差
Routing Edge to Edge Accuracy
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± 0.10mm
(± 0.0040″)
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± 0.05mm
(± 0.0040″)
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± 0.10mm
(± 0.0040″)
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冲型公差
Stamping Edge to Edge Accuracy
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± 0.075mm
(± 0.0030″)
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± 0.10mm
(± 0.0040″)
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N/A
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V-CUT对准公差
V-cut Edge to Edge Accuracy
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± 0.10mm
(± 0.0039″)
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± 0.127mm
(± 0.0050″)
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± 0.10mm
(± 0.0040″)
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镀铜孔公差
PTH Tolerance
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± 0.075mm
(± 0.0029″)
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± 0.05mm
(± 0.0020″)
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± 0.05mm
(± 0.0020″)
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非镀铜孔公差
NPTH Tolerance
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± 0.05mm
(± 0.0020″)
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± 0.038mm
(± 0.0015″)
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± 0.038mm
(± 0.0015″)
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最小机械钻孔径
Min. Drill Size
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0.15mm
( 0.0059″)
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0.15mm
(0.0059″)
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0.15mm
(0.0059″)
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最小激光孔径
Min.Drill Size
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0.10mm
(0.0039″)
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0.075mm
(0.003″)
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0.10mm
(0.004″)
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纵横比
Aspect Ratio
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15:1
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15:1
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10:1
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线宽控制公差
Trace Width Tolerance
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± 10%
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± 10%
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± 10%
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最小线宽
Min.Trace Width
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0.05mm
( 0.0020″)
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0.04mm
(0.0020″)
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0.05mm
(0.0020″)
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层间对准度
Registration(O/L)
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± 0.038mm
( ± 0.0015″)
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± 0.038mm
(± 0.0015″)
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± 0.038mm
(± 0.0015″)
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最小防焊桥
Min.Solder Mask Dam Width
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0.076mm
(0.0030″)
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0.076mm
(0.0030″)
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0.076mm
(0.0030″)
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防焊对准度
S/M Registration
Tolerance
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± 0.038mm
( ± 0.0015″)
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± 0.025mm
(± 0.0015″)
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± 0.038mm
(± 0.0015″)
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最大测试点数
Max.Test Points
/Board(Universal ET)
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针床测试：15000
飞针测试：1-∞
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100,000
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100,000
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最小SMT/QFP
焊盘中心距
Min.SMT/QFP Pitch
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0.250mm
(0.0100″)
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0.40mm
(0.0157″)
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0.40mm
(0.0157″)
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最小BGA焊盘中心距
Min.BGA Pitch
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0.30mm
(0.0118″)
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0.40mm
(0.0157″)
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0.40mm
(0.0157″)
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最大出货单元尺寸
Max.Board/Array Size (Universal ET)
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430mm*1280mm
(16.93″*50.39″)
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400*580mm
(15.75″x22.83″)
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240*533mm
(9.45″x21″)
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阻抗控制公差
Impedance Control Tolerance
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± 5%
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± 8%
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± 8%
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HDI 结构
HDI Structure
1+N+1 \ 2+N+2\3+N+3
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Yes
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Yes
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Yes
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②FPC制程能力 FPC Manufacturing Capability
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项目
Item
|
深圳博敏
Shenzhen Bomin
|
博敏股份
Bomin Electronic
|
江苏博敏
Jiangsu Bomin
|
|
层数
Layer Count
|
/
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1-16L（含软硬结合板）
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1-12L（含软硬结合板）
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最大排版尺寸
Max.PanelSize
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/
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2L：250mm×540mm
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2L：250mm×540mm
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最小完成板厚
Min.Finished Board Thickness
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/
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2L：0.05mm
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2L：0.08mm
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最小线宽
Min.Trace Width
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/
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0.03mm
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0.05mm
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最小孔径
Min.Drill Size
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/
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机械：0.15mm
激光：0.075mm
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0.15mm
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最小基铜厚度
Min.Cu Thickness (Base)
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/
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12um
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12um
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成型公差
Molding Tolerance
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/
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＋/－0.05mm
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＋/－0.05mm
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③SMT制程能力 SMT Manufacturing Capability
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项目
Item
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博敏股份
Bomin Electronic
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贴装范围
Mount Range
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01005 ~ □32mm Chip、SOP、QFP、CSP、BGA…
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贴装精度
Mount Accuracy
重复精度
Repeatability
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±0.05MM
±0.03MM
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最小基板
Minimum Substrate
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L50mm*W50mm
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最大基板
Maximum Substrate
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L510mm*W460mm
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贴装基板厚度
Mounting Substrate Thickness
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0.5 ～ 2.6mm
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工艺
Technology
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有铅锡膏、无铅锡膏、红胶
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